Let's to evaluate if your Component is in risk to be desoldered during their seconf Reflow Process. Most surface mount components will be held in place by the surface tension of the liquid solder alone when run through the re-flow oven second process. This App will support you...
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What's new in the latest 1.0
Last updated on Oct 23, 2022
Minor bug fixes and improvements. Install or update to the newest version to check it out!
Download APK on Android with Free Online APK Downloader - APKPure
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