SMZ Institute

Spogmai Mobile Repairing Institute

Spogmai Mobile Repairing Institute offers Android Advance Chip Level Training, a professional course designed to provide deep knowledge and hands-on skills in mobile repairing. This course is perfect for those who want to learn mobile repairing Level 3 Training and start a successful career in advanced chip-level repair. With the help of expert teachers, you can gain practical knowledge and improve your skills step by step.

What You Will Learn:

1. Mobile Repairing Tools: Comprehensive use of tools, especially Borneo Schematic.

2. Mobile Components: In-depth understanding of all components like Capacitor, Resistor, Coil, Diode, Transistor, Mosfet, LDO, Oscillator, RTC, Band Filter, Antenna Switch, Coupler, and more.

3. Mobile PGA & BGA ICs : Detailed knowledge of ICs such as CPU, RAM, EMMC & UFS, Power IC, 2G/3G/4G/5G PA, RF IC, Light IC, Graphic IC, Audio PA, CDC IC, Charging IC, OVP IC, Wifi IC, Hall IC, Flash Light IC, Extra Buck IC, APT IC, Tuner IC and others.

4. Mobile 30 Protocols: Learn about all mobile protocol in detail.

5. Mobile 32 Sensors: Learn about all mobile sensors and their function in detail.

6. Mobile Sections: Complete understanding of sections like Battery Section, SIM card Section, Memory Card Section, Charging Section, Light Section, Graphics Section, Touch Section, Flash Section, Camera Section, Audio Section, Mic Section, Ringer Section, Handsfree Section, Flash Light Section, Wifi Section, Signal Section, Dead Section and more.

7. Boot Sequence: Complete Understanding Single IC, Double IC, and Triple IC boot processes.

8. Problem Diagnosis: Techniques to finding faults using Power Supply and Smart Charger Readings.

9. Advanced Techniques: Learn IC Reballing, Double Decker, Sandwich, Micro Jumpering, and CPU Drilling.

Join Spogmai Mobile Repairing Institute and become a certified mobile repair export with advanced chip-level skills. Your journey to success starts here!.